Manhattan CPU Thermal Paste Grease,1.5g, Heat sink compound, Syringe, Three Year Warranty, Blister - Termisk paste
FBAC4895-B52C-4E03-B099-A6A8F8B8017B Created with sketchtool. 706D6907-81E1-46A2-B8F9-7B702A1EF2C7 Created with sketchtool. 6A870209-E7F5-44F5-A66F-09E20C85A0DC Created with sketchtool. 0BB04D6C-A9AB-4913-BF4F-5A23954E68E1 Created with sketchtool. 501E26C7-66C1-4DAA-B740-6CFAF55A1B39 Created with sketchtool. C105F7D3-D5EE-43C9-9EE8-05CC42B296D4 Created with sketchtool. D94689D8-7CBB-41C8-AC06-F79D81FF82D5 Created with sketchtool. DA4C7ED9-2512-4D52-94F0-92800F2A6E04 Created with sketchtool. 42E133FD-828F-4CF4-A0BF-560014487A57 Created with sketchtool. F52D9745-4BFD-4506-BEEF-630FD09EF2D9 Created with sketchtool.
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Manhattan CPU Thermal Paste Grease,1.5g, Heat sink compound, Syringe, Three Year Warranty, Blister - Termisk paste

Varenr.: [21145362] | Producent: IC Intracom | Model-nr.: 701662 | EAN: 0766623701662
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Manhattan CPU Thermal Grease helps create maximum surface-to-surface conductivity between a microprocessor and the CPU cooler heat sink to reduce overheating risks. Specially formulated to reliably and easily fill manufacturing imperfections in the wafer and heat sink surfaces, Manhattan CPU Thermal Grease closes critical gaps that can reduce cooling effectiveness and increase possible failure.